Fastline Circuits Co., Limited is one of the most reliable manufacturers and suppliers of aluminum nitride ceramic pcb in China. We are committed to providing high quality customized service to global clients. If you're going to wholesale advanced aluminum nitride ceramic pcb made in China, welcome to get quotation from our factory.
Product Introduction
Aluminum Nitride Ceramic PCB is a ceramic circuit board solution that combines excellent thermal performance with high electrical insulation properties. The AlN substrate provides efficient heat transfer and stable mechanical performance, making it suitable for electronic devices where thermal control and reliability are important.
With its low dielectric loss, good dimensional stability, and strong resistance to thermal stress, Aluminum Nitride Ceramic PCB is widely used in high-performance electronic systems. Fastline supports customized AlN ceramic PCB manufacturing with flexible design options for different application requirements.
Key Features:
Excellent thermal management capability
High electrical insulation reliability
Low dielectric loss for stable signal performance
Good mechanical strength and dimensional stability
Suitable for customized ceramic PCB production
Product Parameters (Specifications)
| Item | Unit | Alumina | AlN | Silicon nitride | ZTA | AlSiC |
|---|---|---|---|---|---|---|
| Ingredients | % | Al₂O₃≥96% | AlN | Si₃N₄ | ZTA(9%ZrO₂) | AlSiC |
| Appearance | / | White | Gray | Gray | White | \ |
| Thickness | mm | 0.25-4.0 | 0.25-3.0 | 0.25-2.0 | 0.25-0.32 | \ |
| Size/L*W | mm | 5050~138190 | 5050~138190 | 5050~300400 | 138*190 | \ |
| Density | g/cm³ | ≥3.75 | ≥3.33 | ≥3.22 | ≥4.0 | ≥3.01 |
| Absorption rate | % | 0 | 0 | 0 | 0 | 0 |
| Heat transfer(20℃) | W/(m·K) | ≥24 | ≥170 | ≥80 | ≥27 | ≥200 |
| Bending strength | MPa | ≥350 | ≥450 | ≥800 | ≥700 | ≥300 |
| Resistivity(20℃) | Omega .cm | ≥10¹⁴ | ≥10¹³ | ≥10¹⁴ | ≥10¹⁴ | \ |
| Permittivity(1MHz) | / | 8-10 | 8-10 | 8-10 | 8-10 | \ |
| Loss(1MHz) | / | ≤3*10⁻⁴ | ≤4.5*10⁻⁴ | ≤2*10⁻⁴ | ≤3*10⁻⁴ | \ |
Key Performance Of Silicon Nitride(Si₃N₄)
| Property sort | Item | Unit | Property Index | Measured |
|---|---|---|---|---|
| Specification | Length | mm | 190.5±0.5 | 190.63 |
| Specification | Width | mm | 138±0.5 | 138.02 |
| Specification | Thickness | mm | 0.25±0.04 | 0.236 |
| Basic Property | Camber | - | ≤0.3% | 0.23% |
| Basic Property | (Ra)/Surface Roughness(Ra) | µm | <0.7 | 0.466 |
| Basic Property | Density | g/cm³ | 3.22±0.04 | 3.221 |
| Physical Property | Bending strength | MPa | ≥700 | 788 |
| Physical Property | Vicker' shardness | HV | ≥14 | 15.03 |
| Physical Property | Young's Modulus | Gpa | ≥240 | 275.233 |
| Physical Property | Fracture toughness | MN/m³/² | ≥6.5 | 7.7 |
| Thermal Property | Thermal conductivity | W/(m·K) | ≥80 | 86.2 |
| Thermal Property | Coefficient of thermal expansion | K | Typ.2.6×10⁻⁶ | 2.73×10⁻⁶ |
| Thermal Property | Dielectric strength | kV/mm | ≥25 | 41.5 |
| Electrical Property | DK@1MHZ | F/m | Typ.7.6 | 8.037@1MHZ7.68@10GHZ |
| Electrical Property | DF@1MHZ | - | ≤5×10⁻³ | 3.56×10⁻³@1MHZ1.33×10⁻³@10GHZ |
Note:
The maximum size of customizable silicon nitride(Si₃N₄) in the future will be around : 300X400mm
Current main tech
| Item | DBC | AMB | DPC |
|---|---|---|---|
| Heat transfer(W/m·K) | Al₂O₃≥24ZTA(9%ZrO₂)≥27 | Al₂O₃≥24AlN≥170Si₃N₄≥80ZTA(9%ZrO₂)≥27 | Al₂O₃≥24AlN≥170Si₃N₄≥80ZTA(9%ZrO₂)≥27 |
| Temp range(°C) | 1065~1085 | ≤800 | 250~350 |
| Circuit production | Image processing | Image processing | Image processing |
| Summary | high-temperature calcinationCopper thickness 0.1-0.4mm | Active brazingCopper thickness 0.1mm-0.8mm | High conductivity,precise circuits,flexible copper.200-300umLow cost |
DBC (Direct Bonded Copper)Copper-Clad Ceramic Substrate
AMB(Active Metal Brazing) Active brazing
DPC (Direct Plate Copper)Copper-Plated Ceramic
DPC Current Capability
| Work | Unit | Cp, Cpk |
|---|---|---|
| Layers | / | Single, double, plated boards |
| Max size | mm | 138190 (Max size adjustable 300400) |
| Tolerance | um | ≤±50 |
| Thickness/Spacing | um | ≥50/50 |
| Hole size | um | ≥50 |
| Copper thickness | um | 2~300 |
| Thickness | mm | 0.15~4.0 |
| Hole-filling ability | / | Aspect ratio≤8:1 |
| Peel strength | N/mm | >2 (IPC-TM-650 2.4.8) |
| Heat-resistant | / | 350±10 ° C, 15minReliable, durable. (IPC-TM-650 2.4.7) |
| Weldability | / | >95%(IPC-TM-650 2.4.14) |
| Polishing | / | OSP/Chemical Ag/immersiontin/ENIG /ENEPIG |
Product Development---Advanced Equipments
Customer visit
Our Package
We use vacuum and carton to wrap the goods, to ensure all them can reach to you completely.
Deliver
While FastlinePCB primarily uses FedEx for international shipping, we also support flexible logistics options. Customers may choose to ship using their own courier accounts or rely on their own freight forwarding partners.
After-Sales Service
All PCB and PCBA products manufactured by FastlinePCB are covered by a 12-month quality warranty starting from the date of shipment. During this period, if any issue is confirmed to be caused by manufacturing defects, our engineering team will respond quickly and evaluate the situation in detail. Depending on the nature of the issue, we will provide appropriate solutions such as repair, replacement, or technical support to ensure the product can meet expected performance requirements.
FAQ
Q: 1. What is the typical material composition of Aluminum Nitride Ceramic PCB?
A: Aluminum Nitride Ceramic PCB uses AlN ceramic as the base substrate material. The ceramic composition and manufacturing process can be selected according to the required thermal, electrical, and mechanical performance of the application.
Q: 2. What alumina ceramic alternatives can be replaced by Aluminum Nitride Ceramic PCB?
A: AlN ceramic PCB is usually selected when standard ceramic materials cannot meet higher thermal requirements. It provides an alternative solution for designs that require improved heat dissipation performance and better thermal stability.
Q: 3. What thickness options are available for Aluminum Nitride Ceramic PCB?
A: The thickness of AlN ceramic PCB depends on the application requirements and mechanical design. Fastline can evaluate suitable thickness options according to customer drawings and product specifications.
Q: 4. Can Aluminum Nitride Ceramic PCB be assembled with standard electronic components?
A: Yes. Aluminum Nitride Ceramic PCB can be used with various electronic components and assembly processes. The suitable assembly method depends on component type, soldering requirements, and application environment.
Q: 5. What surface finishes are available for Aluminum Nitride Ceramic PCB?
A: Surface finish selection depends on the circuit design and assembly requirements. Fastline can provide suitable finishing solutions according to customer specifications.
Q: 6. How does Fastline manufacture Aluminum Nitride Ceramic PCB?
A: Fastline manufactures AlN ceramic PCBs based on customer design files and technical requirements. Our engineering team reviews the PCB structure, material selection, and manufacturing process before production.
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