Half-Hole FR4 Module PCB

Half-Hole FR4 Module PCB (also known as castellated hole PCB) is designed for compact electronic modules that need to be directly soldered onto a main board. The half-cut plated holes on the PCB edge allow strong mechanical connection and reliable electrical contact, making it ideal for modular and space-saving designs.
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Description

Fastline Circuits Co., Limited is one of the most reliable manufacturers and suppliers of half-hole fr4 module pcb in China. We are committed to providing high quality customized service to global clients. If you're going to wholesale advanced half-hole fr4 module pcb made in China, welcome to get quotation from our factory.

 

Product Introduction

Half-Hole FR4 Module PCB (also known as castellated hole PCB) is designed for compact electronic modules that need to be directly soldered onto a main board. The half-cut plated holes on the PCB edge allow strong mechanical connection and reliable electrical contact, making it ideal for modular and space-saving designs.

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FastlinePCB provides precision manufacturing for Half-Hole FR4 PCBs with clean edge plating, accurate routing, and stable hole quality. We support both prototype and mass production, ensuring consistent performance for module integration.

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This type of PCB is widely used in RF modules, IoT devices, Bluetooth/WiFi modules, sensor modules, and communication products. It helps simplify PCB design and improves assembly efficiency by enabling direct surface mounting.

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We also offer full PCB fabrication and assembly services, including SMT, component sourcing, and testing, to support complete turnkey production.

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Product Parameters (Specifications)

Item

Manufacture Capability

Layers

1-50 layers

Material Types

Fr-4, Fr-5, High-Tg, Aluminum Based, Halogen Free, Isola, Taconic, Arlon, Teflon, Rogers

Board Thickness

8mil-236mil(0.2 - 6.0mm)

Solder Mask

Green, Blue, White, Black, Red, Yellow, Purple, etc.

Surface Finishing

HASL, HASL(lead Free), Immersion Gold,Immersion Silver, OSP, Hard Gold (up to 100u" )

Certification

UL, RoHS, ISO9001: 2000, ISO14000: 2004, SGS, ISO13485

Testing

Flying-TEST, E-TEST, X-RAY, Inspection , AOI

Files

Gerber

Special requirements

Buried and blind via + Controlled impedance + BGA

Min. Track Width

8mil-236mil

Min. Track Space

3mil / 0.075mm

 

Customer visit

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Factory

 

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Lead time&Packageing

 

Sample Lead time

Mass production lead time

Single sided PCB

1~3 days

4~7 days

Double sided PCB

2~5 days

7~10 days

Multilayer PCB

7~8 days

10~15 days

PCB Assembly

8~15 days

2~4 weeks

Delivery time

3-7 days

3-7 days

Packing

Electrostatic bag, Foam, Knife card, bubble pack, Carton

 

Delivery & Shipping

FastlinePCB provides flexible and reliable shipping solutions to meet different customer requirements across global markets. Customers are free to use their own courier accounts if they already have preferred logistics partners, or they can rely on our established shipping channels for arrangement. For heavier or bulk PCB and PCBA orders, sea freight is available as a more economical option. We carefully evaluate each shipment to ensure the most suitable balance between cost, speed, and safety.

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After-Sales Service

 

All PCB and PCBA products from FastlinePCB are backed by a 12-month quality assurance policy. If any manufacturing-related defects are identified within this period, our engineering team will take immediate action. Solutions may include reworking the affected boards, providing replacements, or offering technical support to resolve the issue efficiently.

 

FAQ

 

Q1: What PCB technologies can FastlinePCB produce?

We manufacture FR4, HDI, flex, rigid-flex, aluminum, and high-frequency Rogers boards.

Q2: Do you support complex multilayer designs?

Yes, we handle high-layer stack-up PCBs with controlled impedance and advanced routing structures.

Q3: Can you manufacture fine-pitch and HDI boards?

We are equipped for microvia, blind/buried via, and fine-line HDI production.

Q4: Do you produce both prototypes and mass production?

Yes, we support full-scale production from early prototypes to large-volume manufacturing.

 

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