FR4 is a widely used substrate material in PCB (Printed Circuit Board) manufacturing, composed of epoxy resin and fiberglass cloth.
Electrical Properties: FR4 has high dielectric strength (typically 20-30kV/mm) and a stable dielectric constant (approximately 4.3-4.8), making it suitable for high-frequency and high-speed circuit applications.
Mechanical Properties: It has high bending strength (longitudinal ≥400MPa, transverse ≥300MPa), capable of withstanding mechanical stresses during PCB processing and use.
Thermal Properties: The glass transition temperature (Tg) is typically between 130-180℃, exhibiting good heat resistance; some high-performance FR4 boards can reach Tgs above 200℃.
Flame Retardancy: Meets the UL94 V-0 standard, meaning it self-extinguishes within 10 seconds in a vertical burning test.
Environmental Adaptability: Resistant to chemical corrosion and possesses excellent moisture resistance (water absorption <0.1%).